- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
Patent holdings for IPC class H01R 12/77
Total number of patents in this class: 870
10-year publication summary
54
|
71
|
80
|
93
|
80
|
87
|
94
|
75
|
62
|
23
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Yazaki Corporation | 6282 |
46 |
Japan Aviation Electronics Industry, Limited | 1585 |
42 |
Sumitomo Electric Industries, Ltd. | 14131 |
26 |
Sumitomo Wiring Systems, Ltd. | 9367 |
23 |
AutoNetworks Technologies, Ltd. | 5809 |
22 |
Molex, LLC | 1792 |
20 |
Samsung Electronics Co., Ltd. | 131630 |
19 |
Foxconn Interconnect Technology Limited | 1034 |
19 |
3m Innovative Properties Company | 18406 |
18 |
Intel Corporation | 45621 |
17 |
Apple Inc. | 50209 |
15 |
DDK Ltd. | 52 |
15 |
Fujikura Ltd. | 2777 |
14 |
TE Connectivity Solutions GmbH | 2580 |
14 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
13 |
Dai-Ichi Seiko Co., Ltd. | 289 |
12 |
Hirose Electric Co., Ltd. | 325 |
12 |
Iriso Electronics Co., Ltd. | 184 |
11 |
Kyocera Corporation | 12735 |
10 |
Aptiv Technologies AG | 2097 |
9 |
Other owners | 493 |